PCB Assembly Services

Printed Circuit Assembly Services

Sparqtron specializes in high-mix low-volume and medium volume production of PCB assemblies. Our flexibility allows for diverse manufacturing processes that suit any type of product design.

From single-piece prototyping and trouble-free NPI to medium volume production, Sparqtron has you covered. Our expertises is in creating efficient production processes for highly complex PCBA designs. Our global network with factories in Taiwan and China also ensures that you have an easy path to dramatic cost reduction.

  • Click here to find out more about our global network.

PCB Assembly Service Highlights

SMT assembly line
  • Our production area is fully within an ESD and climate controlled environment, ensuring the quality of your products.
  • We offer assembly services for PCBAs that are single- or multi-layer, rigid or flexible, tiny or large.
  • Our thorough design reviews nip problems in the bud and ensure there will be no costly production problems to fix further down the road (see DFM and DFT).
  • Our quick-turn services for prototyping, BGA rework/reballing and engineering changes are as fast as 24 hours (see Prototyping and NPI, BGA Rework/Reballing and ECO).
  • Our materials and logisitics capabilities allows us to accept both consignment and turn-key jobs.
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      Component Capabilities

      Flex cable assembly PCB assembly equipment PCB assembly equipment

      Our efficient process, competent people and capable equipment afford us the capability to directly accommodate most modern surface mount, pin-through-hole and mixed technology components, as well as different types of printed circuit boards.

      Combined with our operations in Taiwan and China, some of our advanced capabilities include:

      • Advanced surface mount (SMT) components
        • Passive component: down to 0201
        • BGA and µBGA: 3000 IO count or more, including double sided
        • BGA rework and reballing
        • Integrated circuits: pitch down to 0.28mm
      • Direct semiconductor integration (by OSE only)
        • Chip-on-board (COB)
        • System-in-package (SiP)
        • Flip chip
      • Adhesive and under-filling (by OSE only)
        • Anisotropic conductive film (ACF)
        • Hot bar bonding
      • PCB format: rigid, flex, thin, rigid-flex
      • Press-fit connectors
      • Aqueous cleaning or no-clean processing
      • Fully lead-free production

      Our flexibility and global support also ensure that any special requirements in components or processes can almost certainly be engineered and implemented.

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