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| Goal |
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To be a CM with a well-established yet flexible infrastructure that meets requirements for all stages of electronic product manufacturing, and allow the customers to manage the operations under their specific and unique needs.
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| Technology and Processes Availability |
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PCBA Process Capability
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| - | Latest equipment from SMT paste printing, pick and place, re-flow and PTH wave soldering for complete PCB assembly.<see details..>
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| - | 0201 small component machine placement capability.
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| - | BGA rework and re-ball capability for chips up-to 1600 pins.
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| - | Process capability for double sided board design with active components, BGA, fine pitch IC or PTH components on both sides.
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| - | Process capability for flex-circuit board with active components for interconnections or thick board for back-plan or mid-plan.
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Inspection and Process Control
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| - | ISO-9001: 2000, and UL registered process control system.
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| - | Unique 3-D real-time integrated data collection, analysis, and reporting system.<see details..>
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Testing and Measurement
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| - | Complete, well-maintained and calibrated latest test and inspection equipment:
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| - | AOI(In-line and Off-line); Flying Probe(With active component test); ICT(5200 Nodes); X Ray(2-D and 3-D); Temperature Cycling Chambers; Walk-in Burn-in Chambers; Cable-Scan Testers; Hi-Pot Testers; and more.
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| - | In-house programming and testing capability.
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| - | Unique 3-D real-time integrated data collection, analysis, and reporting system.
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| - | Unique test strategy with DFT, design for testability, review at the earliest design stage to recover the potential loss in volume stage.
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| | 1st.DFT to assure accessibility and DFM to assure the process yield->
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| | 2nd.Flying Probe (NPI to Pre-Production)->
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| | 3rd.ICT (MID volume)->
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| | 4th.Automated function test with Flying Probe on top of the well fed-back and controlled process with the knowledge learned from the early stages.
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System Integration (Box-Build)
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| - | Operated by experience staff engineers, the well-defined Flex-Cell process is designed to handle high mix, low to mid-volume system build requirements.
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| - | Unique 3-D real-time integrated data collection, analysis, and reporting system tracks to assure the quality and integrity of the whole process to the last step of building a system.
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Distribution, Configure To Order and RMA
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| - | After we completed all the print circuit board assemblies, tested every unit, integrated the system, we can help too to configure the system to the way YOUR customer want.
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| - | And, for the same reason, ship the product for you to your customers. So, virtually, you have owned Sparqtron as your in-house factory so you only see orders and invoices.
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| - | Further more, when there is an RMA from end customers, we take care of it for you too.
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| - | Very importantly, everything will be tracked and monitored with our unique 3-D real-time integrated quality system, started from PCBA all the way to RMA.
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| True Demand Driven Flexibility |
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Since you own the factory, virtually, so tell us what your specific requirements are we will tailor the processes for you.
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NPI, low or mix volume, high volume, on-shore or offshore, you only need one supplier, and Sparqtron can take care the whole requirements for you.
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Established with higher quality and process capability and specifications than the first tier CM, while maintained with better service flexibility than those 2nd tiers with the lowest possible over all cost of service.
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